August 1995 in PDF format (2063K)
Incorporating an STM into an ultra-high-vacuum environment that contains a suitable combination of facilities for sample preparation, material deposition, and complementary diffraction-based surface diagnostics has enabled us to analyze the atomic details of the growth of a variety of thin films for diverse applications. We are currently applying this combination of techniques to evaluate how processing parameters, such as substrate temperature and film deposition rate, affect the atomic structures of interfaces in the fabrication of multilayers for x-ray optics, microelectronics, and magnetic recording devices. The results of these studies allow us to identify the surface defects that have a critical influence on film growth, to investigate their origins, and ultimately to control their occurrence. By doing so, we can improve new materials and devices and give them better performance characteristics.
The Laboratory's Fission Energy and Systems Safety Program (FESSP) performs engineering risk assessments to study and assess the safety, reliability, and effectiveness of various products, processes, and facilities. Evolving methods and techniques are discussed in the context of four cases: an analysis to develop seismic criteria for siting and design of nuclear power plants, risk analysis of reactor coolant piping systems to establish new piping design objectives and increase nuclear power plant safety, study of risks involved in the transport of spent reactor fuel to determine the level of safety provided during transport and the adequacy of existing transport regulations for such material, and development of an approach to identify human-initiated risks in the use of nuclear medical devices such as the Gamma Knife.
and LLNL Disclaimers